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Underwater
Shear Stress Sensor
Yong Xu, Fukang Jiang, Qiao Lin, Jason Clendenen, Steve Tung and Yu-Chong
Tai
Abstract.
A micromachined, vacuum-cavity insulated, thermal shear stress sensor
is developed for underwater applications. The two major challenges for
underwater application, namely the waterproof coating and pressure sensitivity,
are specially studied for our device.
Shear stress measurement is of crucial importance for a lot of fluid
dynamic monitoring/diagnostics applications [1,2,3]. Historically, however,
almost all the MEMS effort has been spent on developing sensors in air,
rather than in liquid (e.g. water). Here, for the first time, we report
the development of a micromachined thermal shear stress sensor for underwater
applications. As shown in Figure 1, the sensor is a polysilicon resistor
sitting on a diaphragm with a vacuum cavity underneath, which provides
excellent thermal isolation to reduce the heat loss to substrate. The
input power of the resistor changes with the wall shear stress of the
ambient fluid and this change can be readily detected electronically.
This design is based on our aerial shear stress sensor [2,3]. However,
there are two major difficult challenges for the underwater applications.
The first challenge is to develop a compatible waterproof coating to
enable the sensor to operate underwater for longer than a month. The
second challenge is to minimize the sensorsÕ pressure sensitivity for
the operation under 10 ft of water, which imposes a 4.3 psi pressure
range. For waterproof coating, LTO was originally investigated, but
then abandoned because the sensor will be integrated onto a flexible
skin [4] and tests show that LTO cracks easily to break metal wires.
Then, Parylene was investigated and proved to be the right waterproof
material because it is flexible, resistant to water transmittance, and
easily CVD-deposited at room temperature [5]. Underwater tests show
that, when operated at 55 °C, sensors coated with 2 mm Parylene-N can
survive in water at least for a month. Longer surviving time is expected
with Parylene-C, which has even smaller moisture vapor transmission.
For pressure sensitivity, ideally the total strain across a clamped-edge
square diaphragm should be zero. However, it is not the real case due
to a lot of reasons, e.g., the intrinsic stress of nitride, the non-ideal
boundary condition. So the applicable way is to decrease the size or
increase the thickness of diaphragm. This, however, leads to more heat
loss to substrate, and decreases the shear stress sensitivity. Here
we report a comparative study on the effect of diaphragm dimension,
which has not been addressed systematically before.
For example, Figure 2 shows a fabricated sensor chip with 2 rows of
sensors with different diaphragm dimensions. We keep the length, L,
a constant (210 mm), but the width, W, varies as 210 mm, 150 mm, 100
mm, 75 mm, and 45 mm. All the sensors have a large effective nitride
thickness, t, of 4.0 mm. For our sensors, the total heat loss includes
conduction loss to substrate (q1, q2, q3, and q4) and convection loss
to fluid (q5) as shown in Figure 1. To achieve a high sensitivity, a
larger q5 is desired. Figure 3 shows the static thermal characteristics
(with zero shear stress) of the 210 mm wide sensor in vacuum, air and
water respectively. In air, q5 only accounts for ~5% of the total heat
loss. In water, q5 has much larger percentage (>45%) as expected. Figure
4 illustrates the static thermal characteristics of the five sensors
in vacuum and water. Even for 45 mm wide sensor, there is still more
than 15% of the power transferred to water. The pressure sensitivity
is illustrated in Figure 5. Interestingly, for our sensor specifications
(a pressure variation of 4.3 psi), 75mm wide sensor is the optimum design.
The 45 mm sensor shows increase of resistance, which is due to the dominance
of the transverse strain when W is much smaller than L. Figure 6 shows
the calibration curve of a 1.8 mm thick, 210 mm´210 mm sensor in water.
A sensitivity of 0.147V/Pascal is observed.
[1] R. J. Goldstein, Fluid Mechanics Measurements, Taylor & Francis,
pp. 575-648, 1996.
[2] C. Liu, Y. C. Tai, J. B. Huang, and C. M. Ho, ASMEÕ94, pp. 9-15
[3] F. Jiang, Y. C. Tai, B. Gupta, R. Goodman, S. Tung, J. B. Huang,
and C. M. Ho, MEMS '96, pp. 110-115
[4] F. Jiang, Y. Xu, T. Weng, Z. Han, Y.C. Tai , A. Huang, C. M. Ho
, and S. Newbern, MEMS '00, pp. 364-369
[5] http://www.paryleneinc.com

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